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Elegrip Tape®  Dicing Tape -UV Series-

Part Number

UDV-80J/UDV-100J/UHP-110B
UHP-0805MC/ UHP-1005M3
UHP-110M3/ UHP-1025M3
UHP-1510M3/ UHP-1525M3
USP-1515M4/ USP-1515MG
UDT-1025MC/ UDT-1325D
UDT-1915MC

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.  High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.  Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.  Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.  Elegrip dicing tapes can correspond with anti-static requirement.  Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.  We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

・Excellent control to back-side chipping and chip fly-off
・Excellent adhesiveness
・Smooth peeling by UV
・High performance to EMC(Epoxy Mold Compound) and other types of difficult-to-adhere workpiece

SPEC

Recommended
Work I
  • Si
  • GaAs
  • Other Semi conductor
Part Number UDV-
80J
UDV-
100J
UHP-
110B
UHP-
0805MC
UHP-
1005M3
UHP-
110M3
Base film PVC PO
Color T MW
Thickness
(μm)
80 100 110 85 105 110
Adhesion
Thickness
(μm)
10 5 10
Adhesive
Strength
(N/20mm)
3.8(0.2) 3.8(0.2) 2.9(0.2) 5.0(0.2) 5.0(0.2) 7.6(0.2)
Probe Tack
(N/20mm2)
2.1(0.05) 2.1(0.05) 2.7(0.05) 1.7(0.05) 2.7(0.05) 3.9(0.05)
characteristic
  • Easy pickup
  • For less chipping
  • For small size chips
Recommended
Work II
  • Package
Part Number UHP-1025M3 UHP-1510M3 UHP-1525M3 USP-1515M4 USP-1515MG
Base film PO
Color MW
Thickness
(μm)
125 160 175 165
Adhesion
Thickness
(μm)
25 10 25 15
Adhesive
Strength
(N/20mm)
12.0(0.2) 6.5(0.2) 13.5(0.2) 14.5(0.2) 15.0(0.2)
Probe Tack
(N/20mm2)
5.5(0.05) 4.2(0.05) 5.6(0.05) 6.2(0.05) 5.9(0.05)
characteristic
  • For encapsulated workpiece
  • For less backside burrs
  • For less glue scratch-up on the chip side walls
  • For less against residue onto a making area
Recommended
Work III
  • Glass
  • Crystal
Part Number UDT-1025MC UDT-1325D UDT-1915MC
Base film PET
Color T
Thickness
(μm)
125 155 203
Adhesion
Thickness
(μm)
25 15
Adhesive
Strength
(N/20mm)
30.0(0.2) 20.4(0.2) 20.3(0.2)
Probe Tack
(N/20mm2)
7.5(0.05) 6.7(0.05) 5.9(0.05)
characteristic
  • For less backside cracking
  • For encapsulated workpiece
  • For less backside cracking

*( ) is adhesive strength after UV.
*The above data is just for representing value, and not guaranteed value.
*Static type is lined up.
*Color : MW (Milky White), T (Transparent)
*UV irradiate condition : Light volume=above 150mJ/cm2.
*UV irradiate condition may change with dicing products.
*Separator thickness is not included.

*The information contained on this website is presented for the purpose of generally advising potential customers of DENKA about the basic description, properties and characteristics of various DENKA products. DENKA makes no warranty or representation as to the entire accuracy or completeness of the Product Information on this website.
*Please test before use, and confirm agreement to use, and safety in your responsibility.
*Please abandon it according to the law when you abandon our product of this website description and the product that used these.
*Please confirm detailed use and notes, with technical information and Material Safety Data Sheet before it uses.
*Specifications in catalogue may change anytime without prior notice.

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