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OTHERS  Silicon Wafer

※Listed Picture: Mirror Type


Available in various thickness, diameter, coating, size and other parameters unique to customer requirements.  We are pleased to receive your inquiries about processed wafers and dummy chips with your designated thickness and chip size.

Feature

・Various experience on processed wafers and chips              
[Processed Type]
Mirror, pear skin finish, various types of coating film (thin coating, thermally-oxidized film, evaporated film) etc.
[Spec.]
SEMI, JEIDA
[Application]
Laboratory research, trial run, solar power battery           

・Adaptable to wide range of spec. (crystal orientation, resistance value, P type / N type etc.)

Basic Specification

Item/Size 2~5inch 6inch 8inch 12inch
Thickness(μm)※*1 ~625 625 725 775
Deposition Film
Dust Free Box Type
BG Processing
(specified thickness)
Making to Chip
Surface Resistance 1~50ΩCm
Crystal Azimuth Various Goods in Stock
Type P or N
Lot 25~ 25~ 25~ 25~

Possible
*1 Please consult about other thickness.

BG Processing

Size 2~5inch 6inch 8inch 12inch
Thickness(μm) 50~ 100~

Dicing Processing

  • ●Less Chipping
  • ●For Thin Wafer (Prevention of chip breakage)

(Sample)

*The information contained on this website is presented for the purpose of generally advising potential customers of DENKA about the basic description, properties and characteristics of various DENKA products. DENKA makes no warranty or representation as to the entire accuracy or completeness of the Product Information on this website.
*Please test before use, and confirm agreement to use, and safety in your responsibility.
*Please abandon it according to the law when you abandon our product of this website description and the product that used these.
*Please confirm detailed use and notes, with technical information and Material Safety Data Sheet before it uses.
*Specifications in catalogue may change anytime without prior notice.

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